Recently, REWA Academy students provided responses that both layers frequently stop working to fit very closely in double-stacked motherboard repair service There are even big gaps, triggering pseudo soldering In reaction, we will certainly share tips and notes when separating and recombining double-stacked motherboard Peel foam on the motherboard before home heating Please be kept in mind that we do not suggest beginners to warm the motherboard with a warm air gun Due to the fact that the motherboard might get warmth unevenly and flaw A specialist motherboard home heating system is what we recommend To help with later removal of the reasoning board, drive a screw on the logic board Cut through the tape with a Sculpture Blade The reasoning board and center layer are soldered with low-temperature solder paste So the very best temperature level for the heating system will certainly be 155 ° C-165 ° C Press the reasoning board delicately with tweezers when the temperature level gets to 165 ° C If the logic board hangs, the tin has melted Clamp the screw to get rid of the logic board Remove the signal board Eliminate thermal oil with a Sculpture Blade Thermal grease have to be removed entirely Otherwise, the thermal grease will certainly touch the logic board to trigger pseudo soldering in recombination Attach the signal board to the holder Use a round of Paste Change Remove tin on the bonding pad with Soldering Iron at 365 ° C and Solder Wick Tin on the bonding pad have to be totally eliminated The residual tin will impact the subsequent soldering Clean the bonding pad with PCB Cleaner Clean the reasoning board with the same approach Please do not harm elements around the bonding pad of the reasoning board while cleaning It is required to inspect if the bonding pad is neat after cleaning up Attach the signal board to the Reballing Platform Placed the reballing pattern ready to see to it that it is pushing versus the signal board To stop the solder paste from moving right into the motherboard void, put a steel plate Use a layer of low-temperature Solder Paste Rub out excess solder paste with a Lint-free Wipe Get rid of the reballing stencil Inspect if solder paste on the signal board is complete While using solder paste, please ensure that solder paste should have a particular humidity If the solder paste is as well dry, it will certainly stick to the reballing pattern when the stencil is gotten rid of Consequently, the solder paste on the signal board will not be consistent, which can easily result in poor soldering Placed the signal board on the 165 ° C Heating Platform to warmth Quit home heating after the solder rounds are developed Apply a percentage of Paste Flux after the signal board has cooled down Align the logic board with the signal board Keep heating on the 165 ° C Home Heating Platform When the solder flux spills and reasoning board sinks, push the reasoning board carefully with tweezers to make sure the 2 layers fit carefully The nudge has to be gentle and tiny Tidy the motherboard with PCB Cleaner after the motherboard has cooled If you locate the motherboard deformed while recombining, you can put the motherboard on a flat board and attach it with a rubber band Press two sides of the motherboard carefully To avoid crushing components, please place a soft paper under the motherboard Next, we will certainly share another recombination method The approach can be taken if the middle bonding pad is not harmed When the tin melts, eliminate the reasoning board in an upright manner with tweezers It can be seen that there is a steel pad of 0.05 mm density around the signal board at a specific distance This metal pad is developed to maintain a 0.05 mm void in between the reasoning board and the middle layer, avoiding the solder balls from linking while soldering You only need to eliminate thermal grease on the motherboard when the repair is done Keep initial tin on the bonding pad Apply a little quantity of Paste Change Finally, line up the reasoning board with the signal board When the temperature level reaches 165 ° C and the tin melts, transform the power off Press two ends of the reasoning board with tweezers up until the motherboard has cooled The reasoning board and the signal board fit closely by doing this There will certainly be no connecting and solder spheres spillover Browse through REWA Academy if you intend to learn even more fixing skills We have total program bundles for motherboard diagnosis and repair work capacity improvement Click the link in the remark section to acquire motherboard repair service training course packages Thank you for enjoying and really feel cost-free to leave a remark
